Germany – Microelectronic machinery and apparatus and microsystems – Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Fraunhofer-Gesellschaft, Einkauf B12
Scope as published
Automated 300 mm Die-to-Wafer thermocompression bonding tool
- Deadline
- Not published
- Published
- 1 Nov 2026(yesterday)
- Contract value
- Not published
- Location
- Germany
- Reference
756518-2026- First seen
- 2 hours ago